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Live Updates  >  Live Update Details

2025-09-19 08:33:55

[Huawei announces two silicon carbide heat dissipation technologies] Recently, Huawei announced two patents: "Thermal Conductive Composition and Its Preparation Method and Application" and "A Thermal Conductive Absorbing Composition and Its Application". Both patents use silicon carbide as filler to improve the thermal conductivity of electronic devices.

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