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2026-05-26 22:53:43
[Industry Insiders: Huawei's "Tao Law" Offers Major Investment Opportunities and New Opportunities for the Chip Industry Chain] Yesterday, at the Shanghai International Circuits and Systems Symposium, He Tingbo, Director of Huawei and President of its Semiconductor Business Unit, released "Tao Law," attracting significant attention from the industry and market. Analysts from securities research institutes explained that with the development of the chip industry in recent years, traditional wafer manufacturing has increasingly approached its limits in pursuing higher precision advanced processes at the two-dimensional level, making technological breakthroughs more difficult and leading to the emergence of various advanced packaging technologies. Huawei's "Tao Law" provides new paths for the industry from multiple perspectives. Industry insiders analyze that the biggest breakthrough of "Tao Law" at this stage is mainly reflected in circuit layer design. If the corresponding chips are successfully mass-produced in the second half of this year, the wafer foundry segment is expected to benefit. In the future, EDA design tools at the software level, as well as upstream equipment and materials, will need to keep pace. US media even predicts that if "Tao Law" can be widely applied, it will have a profound impact on the global chip ecosystem. (CCTV Finance)
