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2025-09-17 21:42:02
[Mt. Chip Technology Co., Ltd. promotes vertical integration of optical communication chips] ⑴ Mt. Chip Technology Co., Ltd. announced that it has formed a vertical integration layout of "optical chips-optical devices-optical modules" in the field of optical communications. ⑵ The company plans to leverage its advantages in vertical integration of the industry chain to promote independent supply of optical communication chips in a step-by-step manner. ⑶ Currently, the 2.5G DFB laser chip has started tape-out, and mass production is expected within 2025. ⑷ The epitaxial growth work of 10G and 25G DFB laser chips has started. ⑸ 50G DFB and CW DFB chips are expected to be launched in 2026. ⑹ The company is actively conducting research and development of silicon-based photonics and PIC technologies. ⑺ The goal is to build solutions for co-packaged optical architectures. ⑻ Provide core support for 800G/1.6T ultra-high-speed interconnection.
